3DInspect Earns 2026 NPI Award for First Article Inspection

The Adaptsys Group has been selected as a 2026 New Product Introduction (NPI) Award winner in the First Article Inspection category for its 3DInspect automated inspection system.

3DInspect was developed to address a common bottleneck in carrier tape verification. The system automates pocket measurement and inspection reporting, replacing manual checks and handwritten documentation with a fast, consistent digital process. What can take up to 30 minutes per reel using traditional methods can now be completed within a minute.

The system also automatically generates Certificates of Conformance (CoCs), reducing paperwork while improving traceability. For manufacturers handling sensitive or high-value components, accurate carrier tape inspection is critical to downstream assembly performance and customer acceptance. By standardizing measurement and reporting, 3DInspect helps reduce variability and provides clear documentation for quality records or customer review.

The 2026 NPI Award recognition highlights the growing demand for smarter, more efficient inspection solutions — and positions 3DInspect as a valuable tool for manufacturers seeking to modernize their first article inspection processes.

The NPI Awards, presented annually by CIRCUITS ASSEMBLY, recognize the most innovative new products introduced to the electronics assembly industry over the past year. Winners are chosen by an independent panel of practicing industry engineers who evaluate products based on innovation, usability, and impact on manufacturing operations.

Service badge from BPM Microsystems

Celebrating 22 Years of Partnership with BPM Microsystems

We’re proud to mark 22 years of partnership with BPM Microsystems.

Since 2003, we’ve had the privilege of distributing BPM’s industry-leading device programming solutions across the UK and beyond. What began as a business relationship has grown into a genuine collaboration, built on trust, shared expertise, and a commitment to delivering real value to our customers.

As our Technical Director put it:

More than a partnership, it’s a synergy.

“Our collaboration with BPM Microsystems has been dynamic and deeply integrated. At Adaptsys, we’ve brought our market knowledge and strong sales and support infrastructure to the table, while BPM has continued to lead the way with cutting-edge programming technology.

Together, we’ve created a powerful presence in the European market, delivering consistent value, driving innovation, and always putting our customers first.”

We’re also proud to share these kind words from Penny Santhanam, Sr. Director of Customer Success at BPM Microsystems:

“For over two decades now, the Adaptsys team has embodied the three qualities our customers prize most—trust, technical depth, and genuine collaboration. Whether it’s tackling a complex automotive MCU or rolling out a new high‑volume production solution, we know Adaptsys will advocate for best‑in‑class outcomes every time. Their commitment to continuous training and on‑site service has been instrumental in our shared success.”

A sincere thank you to the team at BPM Microsystems. It’s been a fantastic journey so far and we’re looking forward to many more years of shared success.

Partnership Highlights

  • 2003 – 2025: Hundreds of BPM programming systems delivered through Adaptsys channels.
  • Technical Centers in the UK, France, Germany, and Hungary provide same‑day remote support and can rapidly respond on‑site when needed.
  • Multi‑language service (English, French, German, Hungarian) covers major European manufacturing hubs.
  • Joint trade‑show presence at Productronica, Electronica, Semicon, and other regional & International events—year after year.
  • Forward focus: Leveraging deep application‑engineering expertise, Adaptsys’ service team functions as a seamless extension of BPM’s own technical organization, delivering expert, factory‑floor support to customers across Europe.

About BPM Microsystems, Inc.

Headquartered in Houston, Texas, BPM Microsystems designs, manufactures and supports automated, semi‑automatic, and manual device‑programming systems that deliver maximum throughput and quality for semiconductor and electronics manufacturers worldwide. Discover more at www.bpmmicro.com.

Digital hand shake with Adaptsys and AAP company logos.

Adaptsys Announce New Partnership With APP

Adaptsys and APP Systems Services Announce Strategic Partnership in Singapore

We’re pleased to announce that Adaptsys has formed a strategic partnership with APP System Services, bringing our innovative Re-flex II inline carrier tape forming technology to customers in Singapore.

This collaboration represents an exciting step forward in our global growth and our commitment to providing localised support in one of Asia’s most vibrant electronics manufacturing markets.

“Adaptsys is thrilled to announce our partnership with APP in Singapore,” says Duncan Milroy, International Sales Manager at Adaptsys. “This collaboration will allow us to bring our innovative Re-flex inline carrier tape forming technology directly to customers within Singapore. The Re-flex system, with its patented ability to form carrier tape inline, offers significant advantages by reducing material costs, simplifying logistics, and improving taping efficiencies for all users in the Singaporean market. We are confident that APP’s local expertise will provide excellent sales and support for our groundbreaking solution.”

With APP’s strong local presence and technical knowledge, customers can now benefit from direct access to a solution that is reshaping tape and reel packing process for electronic components by delivering cost savings, greater efficiency, and reduced environmental impact.

Both companies will be exhibiting at SEMICON Southeast Asia in Singapore. You’ll find Adaptsys at Booth B1917 and APP System Services at Booth B1924. We welcome visitors to drop by or book a meeting with us to explore how Re-flex II can enhance your taping operations.

We’re looking forward to building a strong partnership with APP and supporting even more manufacturers in Singapore and the wider region.

To find out more about Re-flex or what this partnership means for your business, feel free to get in touch with us or APP System Services directly.

Adaptsys to Exhibit at SEMICON SEA 2025

Are you ready to transform your tape and reel packaging process?

From May 20-22, 2025, we’re heading to SEMICON SEA 2025 in Singapore, and we’re excited to showcase something truly impactful.

Visit us at booth B1917 to see a live demonstration of how our product— Re-flex II —  can achieve a more efficient, accurate, and reliable tape and reel packing process.

Register now for your tickets now!

This is more than just integration—it’s about solving real challenges. Imagine eliminating unnecessary downtime, streamlining your workflow, and achieving consistent results every time.

If you’re planning to attend, make sure to stop by booth B1917. Here’s what you can expect:

✔️ Practical insights into improving your processes
✔️ A closer look at a system designed to optimize efficiency
✔️ The chance to connect with us and other industry leaders

We’d also love to hear from you before the show. What’s the biggest challenge you’re facing with tape and reel packing?

Let us know the issues you are facing with your tape and reel packaging process today

Adaptsys to Exhibit at IPC APEX Expo - IPC APEX Logo on white background

Adaptsys to Exhibit at IPC APEX Expo 2025

Are you ready to transform your tape and reel packaging process?

From March 18-20, 2025,  we’re heading to the US to exhibit at IPC APEX Expo, and we’re thrilled to partner with V-TEK to showcase something truly impactful.

Visit us at booth 2414 to see a live demonstration of how our products— the Re-flex II and the TM-50—work seamlessly together to create a more efficient, accurate, and reliable tape and reel packing process.

This is more than just integration—it’s about solving real challenges. Imagine eliminating unnecessary downtime, streamlining your workflow, and achieving consistent results every time.

If you’re planning to attend, make sure to stop by. Here’s what you can expect:

✔️Practical insights into improving your processes

✔️A closer look at a system designed to optimize efficiency

✔️The chance to connect with us and other industry leaders

We’d also love to hear from you before the show. What’s the biggest challenge you’re facing with tape and reel packing?

Let us know the issues you are facing with your tape and reel packaging process today

TV Interview, Camera infocus background blurred

Electronica 2024 WNIE TV Interviews

Electronica 2024 flew past and it was great to see so many familiar faces and meet so many new ones!

As we start to reconnect with everyone we met during Electronica, we also look back at the WNIE TV Interviews that Adaptsys and our partners BPM Microsystems and CheckSum were a part of.

If you couldn’t attend Electronica this year, you can catch up on what you missed on our booth below.

Adaptsys – Duncan Milroy talks Re-flex II, 3DInspect, and new plans for the Asian Market Sector.

BPM Microsystems – Shank Ranganathan talks the all new BPM210.

CheckSum – James Holava discuss the all new ILS-X2 solution.

Adaptsys to Exhibit at Nepcon Japan 2025

Adaptsys to Exhibit at Nepcon Japan

For the first time ever Adaptsys will be exhibiting at Nepcon Japan In January 2025!

This means Re-flex II will be going to Japan for the first time as well!

We can’t wait to meet everyone and demonstrate the capabilities of Re-flex II.

Re-flex II will help you to take control of your component packing process and streamline your tape and reel process. By using carrier tape in its unformed state, there are many advantages to buying carrier tape in the traditional sense of pre-formed reels.

  • Unformed carrier tape takes up less storage space
  • Unformed carrier tape comes in reel of up to 1500m
  • Re-flex II can hold input reels of unformed carrier tape of up to 1500m
  • Re-flex II can produced formed carrier tape directly into your tape and reel system on-demand
  • Re-flex II needs minimal operator intervention and can need Input reels changing over as little as once per shift

Meet with our experts on Booth E19-36, January 22-24, 2025.

Adaptsys to Exhibit at Electronica

It’s been two years since the last Electronica, and that time has flown by!

2024 has been a busy year for us with shows, and we are very excited to end 2024 with Electronica.

Accompanying Adatsys on booth A3.242 will be out partner companies CheckSum and BPM Microsystems. You can expect to see and get hands on with the industry leading systems in Carrier Tape production, Board Testing, and Device Programming.

This is your chance to meet with the experts and take the first step in taking your production to the next level. We can’t wait to meet you all and see some familiar faces throughout Electronica 2024.

Please join us along with our partners on booth A3.242, November 12-15, 2024.

Register here for Electronica 2024

BPM Microsystems announce the worlds first semi-automatic device programmer

BPM Microsystems announce the BPM210

Small but mighty!

BPM Microsystems announce the world’s first semi-automatic device programmer. The BPM210 is a small tabletop system that delivers universal device support, unmatched productivity, and operator safety, making it the ultimate choice for high-volume production programming.

Double the throughput.

With over 35 years’ experience, BPM Microsystems are no stranger when it comes to device programming, so it is safe to say that they know their stuff when it comes down to it.

Conducting time studies, it was clear that when 8 sockets are used per programming site, operators are able to achieve double their throughput with the BPM210. Thanks to the semi-automatic socket actuation system.

Compared to the more traditional manual programmers like the BPM2900 & 2900L, where each socket is opened independently, the test results showed a significant amount of time can be saved.

Load and unload results:

  • BPM210 – 40 seconds
  • BPM2900 – 85 seconds

Just how universal is the BPM210?

Thanks to the use of 10thGen site technology, the BPM210 supports an extensive range of socket adapters, giving you the power to program a vast array of devices, including MCUs, NAND flash, NOR flash, and much more!

The use of active socket adapters features controlled impedance signal paths, providing unmatched signal integrity and ensuring the highest possible first-pass yield, unlike DIP adapters that can degrade signal quality.

Take your programming to the next level.

Once again, BPM Microsystems have broken the mould with the BPM210 and have delivered another disruptive innovative solution, setting the standard for productivity, safety, and universal device support.

When it comes to high-volume production programming, you need a solid solution that offers all the features and support you need to program millions of devices per year.

We understand that everyone’s requirements are unique, Adaptsys take care to fully understand you application requirements thoroughly and offer the necessary technical support to guide you to taking your production to the next level.

Speak with our experts today and take the first step in getting the edge on your competitors.

View BPM210

Adaptsys to exhibit at Micronora 2024.

Adaptsys to exhibit at Micronora 2024

Micronora 2024 is fast approaching and we are happy to announce that we will be exhibiting this year!

Micronora 2024 will take place September 24 – 27, and our experts will be on hand to show you how versatile Re-flex II is.

Re-flex II is commonly used in the electronics and connector industries, but it is not limited to these sectors. In fact, Re-flex II is is a very flexible system and can be used across many industries from Aerospace, electronics, defence, medical all the way through to metal stamping and plastics.

That’s right, Re-flex II offers many benefits to the metal stamping and plastics industries. Using carrier tape to pack your components doesn just offer a simplfied way for your customer to keep track of stock, it allows them to improve there pick and place process, minisie damage to products.

Find out more on how Re-flex II can streamline your packing and tape and reel process and visit our experts at Micronora 2024.